Today, with the accelerating trend of digitalization and high-speed, there is a continuous increase in demand for high-speed interconnection technology in data centers, communication equipment, and industrial systems. The ERNI series under TE Connectivity is renowned for its high-speed cables, backplane connectors, and high-density interconnection solutions. Due to its advantages such as stability, low loss, and high integration, it is widely used in industries such as servers, switches, telecommunication equipment, and industrial control. This article will analyze the performance characteristics, application value, selection points, and domestic alternative solutions for ERNI high-speed cables and backplane connectors.
One, TE ERNI high-speed cable and backplane connection performance analysis
TE Erni products include a variety of high-speed interconnect series such as ERmet ZD, ZDplus, ZDpro, ZDHD, MicroSpeed, and MicroCon. The ERmet ZD series is a typical representative designed for high-speed differential signals, capable of supporting high-speed data transmission from 3Gbps to 10Gbps. The upgraded ZDplus and ZDpro series further enhance the speed to over 20Gbps, meeting the needs of devices with higher bandwidth. These high-speed connectors usually adopt structural designs with high insertion-extraction life and strong contact reliability, while utilizing differential pair optimization, impedance control, shielding structures, and other technologies to improve signal integrity and reduce crosstalk and loss. The press-fit process is widely used in backplane connections, enabling the system to maintain high reliability while reducing the risk of welding processes. In devices with limited space or high modularity, ERNI's MicroSpeed and MicroCon series provide high-density, small pitch board-to-board interconnect solutions that can adapt to the layout requirements of compact high-performance devices.
Selection reference and recommended compatibility alternatives
When selecting cables and connectors for the TE ERNI series, the following aspects can be considered:
According to data rate planning for selection
If the device transmission rate is between 3-10Gbps, you can choose the ERmet ZD series to balance cost and performance.
If the system needs to support 20Gbps or higher bandwidth, it should prioritize the use of the ZDplus / ZDpro / ZDHD series.
2. Match products based on structural dimensions and spatial constraints
Space-saving compact scenarios can prioritize high-density products such as MicroSpeed, MicroCon.
When the backplane and sub-card structure is complex, it is recommended to use the ERmet series high-density modular solution.
Power and signal integration requirement
If synchronization of high current supply and high-speed signal is required, the ERNI power tap power connector combined with a high-speed backplane connection scheme can be selected to ensure system stability.
4. Compatibility and Domestic Substitution Suggestions
In the existing ERmet ZD system, to improve speed, ERmet ZDplus/ZDpro can usually be directly compatible with the backplane end without significant structural changes, only replacing the sub-card end with a higher-speed model is required.
When considering domestic substitution, it can be evaluated based on domestic interconnect devices such as 2mm hard metric connectors, 1.27mm/2.54mm spacing products, but it is necessary to focus on checking:
Signal Integrity (SI)
Impedance control consistency
Interference performance
Screen blocking effect
Insertion/extraction life and contact reliability
Material process stability
The core of domestic substitution is to ensure that the overall high-speed signal performance of the system is not compromised while the cost is reduced, therefore, it is recommended to carry out strict testing and verification before mass production.
The TE Erni series, with its design philosophy of high speed, high reliability, high density, and modularity, has become an important interconnection solution in fields such as data centers, communication, industry, and embedded devices. Whether it is high-speed backplane interconnection or high-density cable connections for compact devices, ERNI can provide a stable, mature, and professional product system. Under the trend of high-speed computing and intelligent manufacturing in the future, its value of high-speed interconnection will be even more prominent.
We have been focusing on the domestic substitution research and market application development of ERNI brand connectors for a long time. If you are interested in ERNI or its domestic substitution solutions, have procurement needs, or are looking for a more cost-effective interconnection solution, please contact Manager Zhang.
18665383950, WeChat number the same), we look forward to in-depth communication and cooperation with more industry partners.
