High-speed interconnect solution for AI image systems: The key role of extremely thin coaxial cable bundles

In the AI era, camera modules have become the core perception units of various intelligent devices. From security monitoring, autonomous driving, to smart home and industrial inspection, image systems are continuously developing towards higher resolution, higher frame rates, and lower latency. With the rapid growth of image data volume, the performance of the signal transmission chain has gradually become a key factor restricting system upgrades. The limitations of traditional wiring and FPC materials in high-speed scenarios are becoming increasingly evident, and ultra-thin coaxial cable bundles are beginning to become the mainstream choice.

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The interconnection challenges brought by the growth of AI image data

AI camera modules need to continuously transmit high-speed image data at rates of several Gbps even up to more than ten Gbps during operation. Under high-frequency conditions, traditional wiring or flexible FPC are more prone to crosstalk, reflection, and signal attenuation, which can lead to image delay, noise, or reduced stability. AI algorithms have extremely high requirements for real-time performance, and in applications such as autonomous driving and industrial inspection, even slight transmission delays can affect recognition accuracy and system response capabilities, which poses higher requirements for the signal chain.

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The performance advantages of ultra-fine coaxial beam

The extremely thin coaxial cable bundle consists of a central conductor, insulation layer, shielding layer, and outer sheath, and can maintain a stable characteristic impedance and good signal integrity during high-speed transmission. Its multi-layer shielding structure can effectively suppress external electromagnetic interference and is suitable for stable operation in complex electromagnetic environments. At the same time, the extremely thin wire diameter and good flexibility make it meet the high-density wiring requirements inside camera modules with limited space, and maintain a reliable service life in high-frequency bending or motion scenarios, compatible with various high-speed interfaces such as MIPI, LVDS, and eDP.

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Chapter 3: The Continuous Evolution of AI Camera Modules

With the continuous improvement of AI algorithm and image processing chip computing power, camera modules are developing towards high resolution, multi-lens, and multi-channel synchronous directions. 8K imaging, 3D perception, and deep vision applications further increase the requirements for bandwidth and signal integrity. Extremely thin coaxial cables, with their high bandwidth, low loss, and high reliability, have been widely used in AI camera module, ToF depth camera, binocular vision, and infrared imaging systems, becoming a key component of AI vision architecture.

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The performance improvement of camera module depends not only on the algorithm and chip capability, but also on the stability of the underlying high-speed signal chain. The extremely thin coaxial cable bundle, as an important carrier for connecting image data with the computing system, plays a decisive role in high bandwidth, low latency, and anti-interference. As AI devices continue to develop towards high-speed, lightweight, and highly integrated directions, the application of extremely thin coaxial cable bundles will become more widespread.

I amSuzhou Huichengyuan Electronic Technology,Long-term focus on the design and customization of high-speed signal cable harnesses and ultra-fine coaxial cable harnesses, providing stable and reliable high-speed interconnection solutions for AI imaging and intelligent devices. For more information, please contactManager Zhang: 18913228573 (same as WeChat)。