2025-02-25
The Panasonic AXT630124 CONN HDR 30POS SMD GOLD is a high-performance 30-position surface mount connector with a gold-plated center contact design for board-to-board interconnections in a variety of e...
2025-02-22
Hirose FH26W-39S-0.3SHW(60) connectors feature an ultra-small pitch of 0.30mm, support for 39-pin positions, and are compatible with FPCs of 0.20mm thickness to ensure the reliability of high-density ...
2025-02-22
Hirose FH28E-60S-0.5SH(05) connectors are designed with a 0.50mm pitch to support 60-pin positions and are compatible with FFC/FPC with 0.30mm thickness to ensure efficient signal transmission and sta...
2025-02-22
The Hirose FH34SRJ-4S-0.5SH(99) connector is designed with a 0.50mm pitch, supports 4-pin positions, and is compatible with FFC/FPC of 0.30mm thickness to ensure efficient signal transmission.
2025-02-22
The Hirose FH23-39S-0.3SHW(05) connector features a 0.30mm ultra-fine pitch design that supports 39-pin positions and is compatible with FPCs up to 0.20mm thick, ensuring efficient signal transmission...
2025-02-22
FH12A-33S-0.5SH(55) connector is designed with 0.50mm pitch, supports 33-pin position, and is compatible with FFC/FPC with 0.30mm thickness, ensuring efficient and stable signal transmission.
2025-02-22
The KYOCERA 145046080630868+ connector product features 80 pin positions with a pitch of 0.50mm and a 2-row configuration for application scenarios that require high density, compact connections.
2025-02-22
The 245846050100829+ connector features a centralized ribbon contact structure with 50 pin positions and a pitch of only 0.40mm, and is available in a 2-row configuration that meets the demand for hig...
2025-02-22
The 145846050000829+ features an overmolded contact structure with 50 pin positions, a 0.40mm pitch, and a 2-row configuration that enables high-density signal connections for electronics that require...
2025-02-22
The 245047050900829+ features a centralized band contact structure with 50 pin positions and a pitch of only 0.50mm, making it suitable for applications requiring high-density, high-speed signal trans...
